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SC820 Semiconductor packaging spray cleaning machine with liquid wash DI water rinse and hot air dry

SIP packaging cleaning machine
December 09, 2021
Category Connection: 반도체 크리닝 장치
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태그:
#600 밀리미터 반도체 크리닝 장치 #SC 820 반도체 크리닝 장치 #장비를 청소하는 1650 밀리미터 자동차
Brief: Discover the SC810 Semiconductor Packaging Deflux Machine, a compact in-line spray cleaning solution for leadframe, IGBT, IPM, BGA, and CSP packages. Featuring liquid wash, DI water rinse, and hot air dry, this CE-approved machine ensures thorough flux removal with advanced spray technology and PLC control.
Related Product Features:
  • Compact in-line spray cleaning machine for leadframe, IGBT, IPM, BGA, and CSP packages.
  • Uses liquid wash and DI water rinse followed by hot air dry for thorough cleaning.
  • Features SME's latest mix spray cleaning technology for superior results.
  • Adjustable spray pressure for different semiconductor cleaning requirements.
  • Equipped with a resistivity monitoring system (0~18 MΩ).
  • SUS304 stainless steel PCB flat conveyor net system for durability.
  • PLC control system with an English operation interface for ease of use.
  • Total SUS304 structure resistant to acid and alkali corrosion.
자주 묻는 질문:
  • What kind of semiconductor products can the SC810 clean?
    The SC810 can clean flux on BGA, CSP, IGBT, IPM, and leadframe packages, thanks to its powerful 600mm wash section with 2x8 spray rods.
  • Why does the SC810 require 110KW of power?
    The power is used for heaters in the wash, pre-rinse, rinse, and hot air dry sections, along with air blowers and electric pumps, totaling 110KW.
  • What are the temperature settings for the liquid and DI water?
    The liquid can be heated up to 80℃, and the DI water can be heated up to 60℃ for optimal cleaning performance.
  • Does the SC810 support customization?
    Yes, the SC810 offers many optional functions to meet specific customer requirements.
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